Publication
Ultrathin, High Capacitance Capping Layers for Silicon Electronics with Conductive Interconnects in Flexible, Long‐Lived Bioimplants
작성자 관리자
날짜 2022-02-16 11:44:30
조회수 136
⦁ 저자 : Jinghua Li, Rui Li, Chia‐Han Chiang, Yishan Zhong, Haixu Shen, Enming Song, Mackenna Hill, Sang Min Won, Ki Jun Yu, Janice Mihyun Baek, Yujin Lee, Jonathan Viventi, Yonggang Huang, John A Rogers
⦁ 저널 : Advanced Materials Technologies
⦁ 연도 : 2020
⦁ IF : 7.848
⦁ Citation : 6
https://onlinelibrary.wiley.com/doi/full/10.1002/admt.201900800
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